发明授权
US08878335B2 Method and system for providing fusing after packaging of semiconductor devices
有权
用于在半导体器件封装之后提供熔化的方法和系统
- 专利标题： Method and system for providing fusing after packaging of semiconductor devices
- 专利标题（中）： 用于在半导体器件封装之后提供熔化的方法和系统
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申请号： US12977104申请日： 2010-12-23
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公开(公告)号： US08878335B2公开(公告)日： 2014-11-04
- 发明人: Thorsten Meyer , Josef Boeck , Rudolf Lachner , Herbert Schaefer
- 申请人： Thorsten Meyer , Josef Boeck , Rudolf Lachner , Herbert Schaefer
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L29/00
- IPC分类号： H01L29/00 ; H01L23/525 ; H01L21/66
摘要：
A method and a system for providing fusing after packaging of semiconductor devices are disclosed. In one embodiment, a semiconductor device is provided comprising a substrate comprising a fuse area, at least one fuse disposed in the fuse area, and at least one layer disposed over the substrate, wherein the at least one layer comprises at least one opening exposing the at least one fuse.
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