Invention Grant
- Patent Title: Structural body and method for manufacturing semiconductor substrate
- Patent Title (中): 半导体衬底的结构体和方法
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Application No.: US13577117Application Date: 2011-02-08
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Publication No.: US08878345B2Publication Date: 2014-11-04
- Inventor: Takafumi Yao , Hyun-Jae Lee , Katsushi Fujii
- Applicant: Takafumi Yao , Hyun-Jae Lee , Katsushi Fujii
- Applicant Address: JP Tokyo
- Assignee: AETech Corporation
- Current Assignee: AETech Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-028184 20100210
- International Application: PCT/JP2011/052604 WO 20110208
- International Announcement: WO2011/099469 WO 20110818
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L29/04 ; H01L21/02 ; C30B29/40 ; C30B25/18

Abstract:
A structural body includes a sapphire underlying substrate; and a semiconductor layer of a group III nitride semiconductor disposed on the underlying substrate. An upper surface of the underlying substrate is a crystal surface tilted at an angle of 0.5° or larger and 4° or smaller with respect to a normal line of an a-plane which is orthogonal to an m-plane and belongs to a {11-20} plane group, from the m-plane which belongs to a {1-100} plane group.
Public/Granted literature
- US20130062739A1 STRUCTURAL BODY AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE Public/Granted day:2013-03-14
Information query
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