Invention Grant
US08878345B2 Structural body and method for manufacturing semiconductor substrate 有权
半导体衬底的结构体和方法

Structural body and method for manufacturing semiconductor substrate
Abstract:
A structural body includes a sapphire underlying substrate; and a semiconductor layer of a group III nitride semiconductor disposed on the underlying substrate. An upper surface of the underlying substrate is a crystal surface tilted at an angle of 0.5° or larger and 4° or smaller with respect to a normal line of an a-plane which is orthogonal to an m-plane and belongs to a {11-20} plane group, from the m-plane which belongs to a {1-100} plane group.
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