发明授权
- 专利标题： Semiconductor device and method of assembling same
- 专利标题（中）： 半导体装置及其组装方法
-
申请号： US13854137申请日： 2013-04-01
-
公开(公告)号： US08878348B2公开(公告)日： 2014-11-04
- 发明人: Meiquan Huang , Huan Wang , Jinsheng Wang , Naikuo Zhou
- 申请人： Meiquan Huang , Huan Wang , Jinsheng Wang , Naikuo Zhou
- 申请人地址： US TX Austin
- 专利权人： Freescale Semicondustor, Inc.
- 当前专利权人： Freescale Semicondustor, Inc.
- 当前专利权人地址： US TX Austin
- 代理商 Charles Bergere
- 优先权： CN201210334279 20120911
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/367
摘要：
A semiconductor device has a die support and external leads formed integrally from a single sheet of electrically conductive material. A die mounting substrate is mounted on the die support, with bonding pads coupled to respective external connection pads on an external connector side of the substrate. A die is attached to the die mounting substrate with die connection pads. Bond wires selectively electrically couple the die connection pads to the external leads and the bonding pads and electrically conductive external protrusions are mounted to the external connection pads. An encapsulant covers the die and bond wires. The external protrusions are located at a central region of a surface mounting side of the package and the external leads project outwardly from locations near the die support towards peripheral edges of the package.
公开/授权文献
- US20140070388A1 SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME 公开/授权日：2014-03-13