Invention Grant
US08882312B2 Light emitting device with light emitting diodes fixed to printed circuit
有权
具有固定在印刷电路板上的发光二极管的发光装置
- Patent Title: Light emitting device with light emitting diodes fixed to printed circuit
- Patent Title (中): 具有固定在印刷电路板上的发光二极管的发光装置
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Application No.: US13206910Application Date: 2011-08-10
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Publication No.: US08882312B2Publication Date: 2014-11-11
- Inventor: Tae-Joon Kim , Sang-Hee Lee
- Applicant: Tae-Joon Kim , Sang-Hee Lee
- Applicant Address: KR Yongin, Gyeonggi-Do
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin, Gyeonggi-Do
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: KR10-2010-0138035 20101229
- Main IPC: F21V29/00
- IPC: F21V29/00 ; H05K1/18
Abstract:
A light emitting diode package module includes a printed circuit board, a wiring film and light emitting diode packages. The printed circuit board includes first regions and second regions, which are alternately disposed. The wiring film is disposed over the printed circuit board and includes first sections and second sections, which are alternately disposed. Each diode package is disposed between one of the first regions and one of the first sections. The light emitting diode package is electrically connected to the wiring film. The second sections and the second regions are adhered to each other so that the wiring film and the printed circuit board are electrically connected.
Public/Granted literature
- US20120170290A1 LIGHT EMITTING DIODE PACKAGE MODULE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-07-05
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