发明授权
- 专利标题: Semiconductor device and method for manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US13353707申请日: 2012-01-19
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公开(公告)号: US08884306B2公开(公告)日: 2014-11-11
- 发明人: Takashi Kyono , Kuniaki Ishihara , Akihiro Hachigo , Takahisa Yoshida , Masaki Ueno , Makoto Kiyama
- 申请人: Takashi Kyono , Kuniaki Ishihara , Akihiro Hachigo , Takahisa Yoshida , Masaki Ueno , Makoto Kiyama
- 申请人地址: JP Osaka-shi, Osaka
- 专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人地址: JP Osaka-shi, Osaka
- 代理机构: Drinker Biddle & Reath LLP
- 优先权: JP2011-029867 20110215
- 主分类号: H01L29/15
- IPC分类号: H01L29/15 ; H01L31/0256 ; H01L33/00 ; H01L33/02
摘要:
A semiconductor device includes a supporting substrate, a conductive layer placed on the supporting substrate, and at least one group III nitride semiconductor layer placed on the conductive layer. Of the group III nitride semiconductor layers, a conductive-layer-neighboring group III nitride semiconductor layer has n type conductivity, dislocation density of at most 1×107 cm−2, and oxygen concentration of at most 5×1018 cm−3. Thus, an n-down type device having a semiconductor layer of high crystallinity can be provided.
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