Invention Grant
US08884352B2 Method for manufacturing a memory cell, a method for manufacturing a memory cell arrangement, and a memory cell
有权
存储单元的制造方法,存储单元配置的制造方法以及存储单元
- Patent Title: Method for manufacturing a memory cell, a method for manufacturing a memory cell arrangement, and a memory cell
- Patent Title (中): 存储单元的制造方法,存储单元配置的制造方法以及存储单元
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Application No.: US13646797Application Date: 2012-10-08
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Publication No.: US08884352B2Publication Date: 2014-11-11
- Inventor: Danny Shum , Christoph Bukethal , Martin Stiftinger , John Power
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L27/115
- IPC: H01L27/115

Abstract:
A method for manufacturing a memory cell in accordance with various embodiments may include: forming at least one charge storing memory cell structure over a substrate, the charge storing memory cell structure having a first sidewall and a second sidewall opposite the first sidewall; forming an electrically conductive layer over the substrate and the charge storing memory cell structure; patterning the electrically conductive layer to form a spacer at the first sidewall and a blocking structure at the second sidewall of the charge storing memory cell structure; implanting first dopant atoms to form a first doped region in the substrate proximate the spacer, wherein the first dopant atoms are blocked by the blocking structure; removing the blocking structure after implanting the first dopant atoms; implanting second dopant atoms to form a second doped region in the substrate proximate the second sidewall of the charge storing memory cell structure.
Public/Granted literature
Information query
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