Invention Grant
- Patent Title: Substrate for semiconductor package and process for manufacturing
- Patent Title (中): 半导体封装基板和制造工艺
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Application No.: US13895704Application Date: 2013-05-16
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Publication No.: US08884443B2Publication Date: 2014-11-11
- Inventor: Tien-Szu Chen , Chun-Che Lee , Sheng-Ming Wang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Klein, O'Neill & Singh, LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/48 ; H01L23/00 ; H01L21/768
Abstract:
A semiconductor package substrate includes a core portion, an upper circuit layer and a plurality of pillars. The pillars are disposed on and project upward from the upper circuit layer. Top surfaces of the pillars are substantially coplanar. The pillars provide an electrical interconnect to a semiconductor die. Solder joint reliability as between the substrate and the semiconductor die is improved.
Public/Granted literature
- US20140008814A1 SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND PROCESS FOR MANUFACTURING Public/Granted day:2014-01-09
Information query
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