Invention Grant
- Patent Title: Radiation-sensitive resin composition
- Patent Title (中): 辐射敏感树脂组合物
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Application No.: US13789742Application Date: 2013-03-08
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Publication No.: US08889335B2Publication Date: 2014-11-18
- Inventor: Ken Maruyama
- Applicant: JSR Corporation
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-202360 20100909; JP2010-261873 20101125
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/11 ; G03F7/004 ; G03F7/033 ; G03F7/038 ; G03F7/20

Abstract:
A radiation-sensitive resin composition includes a compound represented by a formula (1), and a polymer that serves as a base resin. R1 is a monovalent group that includes at least two groups of —CO—, —NH—, —S—, and —SO2—, the at least two groups being each identical or different. A is a divalent hydrocarbon group or a divalent fluorohydrocarbon group having 1 to 5 carbon atoms. R is a fluorine atom or a hydrogen atom. a is an integer from 1 to 4. In a case where a plurality of R are present, each of the plurality of R is either identical or different. M+ is a monovalent cation.
Public/Granted literature
- US20130183624A1 RADIATION-SENSITIVE RESIN COMPOSITION Public/Granted day:2013-07-18
Information query
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