Invention Grant
US08890165B2 Method of forming polycrystalline silicon layer, thin film transistor, organic light emitting diode display device having the same, and methods of fabricating the same
有权
形成多晶硅层的方法,薄膜晶体管,具有该多晶硅层的有机发光二极管显示装置及其制造方法
- Patent Title: Method of forming polycrystalline silicon layer, thin film transistor, organic light emitting diode display device having the same, and methods of fabricating the same
- Patent Title (中): 形成多晶硅层的方法,薄膜晶体管,具有该多晶硅层的有机发光二极管显示装置及其制造方法
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Application No.: US12714154Application Date: 2010-02-26
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Publication No.: US08890165B2Publication Date: 2014-11-18
- Inventor: Dong-Hyun Lee , Ki-Yong Lee , Jin-Wook Seo , Tae-Hoon Yang , Maxim Lisachenko , Byoung-Keon Park , Kil-Won Lee , Jae-Wan Jung
- Applicant: Dong-Hyun Lee , Ki-Yong Lee , Jin-Wook Seo , Tae-Hoon Yang , Maxim Lisachenko , Byoung-Keon Park , Kil-Won Lee , Jae-Wan Jung
- Applicant Address: KR Yongin
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2009-0109835 20091113
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L27/12 ; H01L29/786 ; H01L21/02 ; H01L29/66

Abstract:
A method of forming a polycrystalline silicon layer, a thin film transistor (TFT), an organic light emitting diode (OLED) display device having the same, and methods of fabricating the same. The method of forming a polycrystalline silicon layer includes providing a substrate, forming a buffer layer on the substrate, forming an amorphous silicon layer on the buffer layer, forming a groove in the amorphous silicon layer, forming a capping layer on the amorphous silicon layer, forming a metal catalyst layer on the capping layer, and annealing the substrate and crystallizing the amorphous silicon layer into a polycrystalline silicon layer.
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