发明授权
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US13348961申请日: 2012-01-12
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公开(公告)号: US08890253B2公开(公告)日: 2014-11-18
- 发明人: Yung-Fa Lin , Shou-Yi Hsu , Meng-Wei Wu , Yi-Chun Shih , Main-Gwo Chen
- 申请人: Yung-Fa Lin , Shou-Yi Hsu , Meng-Wei Wu , Yi-Chun Shih , Main-Gwo Chen
- 申请人地址: TW Hsinchu
- 专利权人: Anpec Electronics Corporation
- 当前专利权人: Anpec Electronics Corporation
- 当前专利权人地址: TW Hsinchu
- 代理机构: Stroock & Stroock & Lavan LLP
- 优先权: TW100111040A 20110330
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L29/78 ; H01L29/417 ; H01L29/06 ; H01L29/40 ; H01L29/10
摘要:
A semiconductor device includes: a substrate including a first epitaxial layer that has a first electrical type, and a second epitaxial layer; a transistor that includes a source region and an insulating spacer; an inner surrounding structure including an annular trench and an insulating spacer; an outer surrounding structure that has a second electrical type opposite to the first electrical type, and that is disposed adjacent to an upper surface of the second epitaxial layer to surround and contact the inner surrounding structure; and a conductive structure connecting to the source region, and the inner and outer surrounding structures.
公开/授权文献
- US20120248540A1 SEMICONDUCTOR DEVICE 公开/授权日:2012-10-04
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