发明授权
US08890533B2 Apparatus for inspecting light emitting diode package and inspecting method using the same
有权
用于检查发光二极管封装的装置和使用其的检查方法
- 专利标题： Apparatus for inspecting light emitting diode package and inspecting method using the same
- 专利标题（中）： 用于检查发光二极管封装的装置和使用其的检查方法
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申请号： US12957931申请日： 2010-12-01
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公开(公告)号： US08890533B2公开(公告)日： 2014-11-18
- 发明人: Ssang Gun Lim , Seung Gyu Ko , Dae Kab Kwon , Ju Hun An , Won Soo Ji
- 申请人： Ssang Gun Lim , Seung Gyu Ko , Dae Kab Kwon , Ju Hun An , Won Soo Ji
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2009-0117953 20091201
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/67 ; G09G3/14
摘要：
An apparatus for inspecting a light emitting diode (LED) package is provided to inspect an LED to determine whether or not it is defective, and discard the LED when the LED is defective. The apparatus for inspecting an LED package includes: an inspection unit inspecting an LED through a visual inspection to determine whether or not the LED is defective; and a defective product rejection unit discarding the LED when the LED is determined to be defective on the basis of inspection results from the inspection unit among LEDs supplied from the inspection unit. Because the operation of inspecting LEDs and discarding a defective LED are automated and can be rapidly processed as a sequential process, productivity can be improved.
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