发明授权
US08891356B2 System and method for multi-point HSDPA communication utilizing a multi-link RLC sublayer
有权
利用多链路RLC子层的多点HSDPA通信的系统和方法
- 专利标题： System and method for multi-point HSDPA communication utilizing a multi-link RLC sublayer
- 专利标题（中）： 利用多链路RLC子层的多点HSDPA通信的系统和方法
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申请号： US13169874申请日： 2011-06-27
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公开(公告)号： US08891356B2公开(公告)日： 2014-11-18
- 发明人: Danlu Zhang , Sharad Deepak Sambhwani , Rohit Kapoor , Jilei Hou , Weiyan Ge
- 申请人： Danlu Zhang , Sharad Deepak Sambhwani , Rohit Kapoor , Jilei Hou , Weiyan Ge
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM Incorporated
- 当前专利权人： QUALCOMM Incorporated
- 当前专利权人地址： US CA San Diego
- 主分类号： G01R31/08
- IPC分类号： G01R31/08 ; G06F11/00 ; H04L1/18 ; H04L25/14 ; H04W28/04 ; H04W76/02
摘要：
A method and apparatus for wireless communication may provide a multi-link RLC sublayer in an RNC capable of allocating RLC PDUs among a plurality of MAC entities for use in a Multi-Point HSDPA network. Some aspects of the disclosure address issues relating to out-of-order delivery of the RLC PDUs to a UE, such as unnecessary retransmissions. That is, the disclosed multi-link RLC may be capable of distinguishing between sequence number gaps that are caused by physical layer transmission failures and those caused merely by skew.
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