Invention Grant
- Patent Title: Contact with anti-rotation elements and solder flow abatement
- Patent Title (中): 接触抗旋转元件和消除焊料流动
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Application No.: US13780339Application Date: 2013-02-28
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Publication No.: US08894423B2Publication Date: 2014-11-25
- Inventor: John Mongold , Randall Musser , Brian Vicich , Neal Patterson
- Applicant: Samtec, Inc.
- Applicant Address: US IN New Albany
- Assignee: Samtec, Inc.
- Current Assignee: Samtec, Inc.
- Current Assignee Address: US IN New Albany
- Agency: Keating & Bennett, LLP
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R13/02 ; H01R13/428 ; H01R13/41 ; H01R12/57 ; H01R13/11 ; H01R12/71

Abstract:
A contact includes a head, a tail including an opening, a body connected at one end thereof to the head and at another end thereof to the tail, a first lance and a second lance extending from the body, a dimple raised from the body, and a solder member attached to the tail such that the solder member engages at least a portion of the opening. The first lance and the second lance are arranged to deflect when the contact is inserted into a connector; and the first lance, the second lance, and the dimple are arranged to frictionally secure the contact to the connector.
Public/Granted literature
- US20140242817A1 CONTACT WITH ANTI-ROTATION ELEMENTS AND SOLDER FLOW ABATEMENT Public/Granted day:2014-08-28
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