发明授权
US08895359B2 Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus
有权
半导体器件，倒装芯片安装方法和倒装芯片安装装置
- 专利标题： Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus
- 专利标题（中）： 半导体器件，倒装芯片安装方法和倒装芯片安装装置
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申请号： US13056462申请日： 2009-11-06
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公开(公告)号： US08895359B2公开(公告)日： 2014-11-25
- 发明人: Yoshihiro Tomura , Kazumichi Shimizu , Kentaro Kumazawa
- 申请人： Yoshihiro Tomura , Kazumichi Shimizu , Kentaro Kumazawa
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Hamre, Schumann, Mueller & Larson, P.C.
- 优先权： JP2008-319040 20081216; JP2008-331662 20081226
- 国际申请： PCT/JP2009/005890 WO 20091106
- 国际公布： WO2010/070806 WO 20100624
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/44 ; H01L23/58 ; H01L23/12 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/56 ; H01L23/31 ; H01L23/00
摘要：
A semiconductor chip (1) is flip-chip mounted on a circuit board (4) with an underfill resin (6) interposed between the semiconductor chip (1) and the circuit board (4) and a container covering the semiconductor chip (1) is bonded on the circuit board (4). At this point, the semiconductor chip (1) positioned with the underfill resin (6) interposed between the circuit board (4) and the semiconductor chip (1) is pressed and heated by a pressure-bonding tool (8); meanwhile, the surface of the underfill resin (6) protruding around the semiconductor chip (1) is pressed by the pressure-bonding tool (8) through a film (13) on which a surface unevenness is formed in a periodically repeating pattern, so that a surface unevenness (16a) is formed. The inner surface of the container covering the semiconductor chip (1) is bonded to the surface unevenness (16a) on the surface of the underfill resin.
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