Invention Grant
- Patent Title: Methods for bonding material layers to one another and resultant apparatus
- Patent Title (中): 将材料层彼此粘合的方法和合成装置
-
Application No.: US13775890Application Date: 2013-02-25
-
Publication No.: US08895362B2Publication Date: 2014-11-25
- Inventor: James Gregory Couillard , Christopher Paul Daigler , Jiangwei Feng , Yawei Sun , Lili Tian , Ian David Tracy
- Applicant: Corning Incorporated
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Timothy M Schaeberle
- Main IPC: H01L23/15
- IPC: H01L23/15 ; H01L21/82 ; B81C3/00 ; G02B26/08
Abstract:
Methods and apparatus provide for a structure, including: a first glass material layer; and a second material layer bonded to the first glass material layer via bonding material, where the bonding material is formed from one of glass frit material, ceramic frit material, glass ceramic frit material, and metal paste, which has been melted and cured.
Public/Granted literature
- US20130221510A1 METHODS FOR BONDING MATERIAL LAYERS TO ONE ANOTHER AND RESULTANT APPARATUS Public/Granted day:2013-08-29
Information query
IPC分类:
