发明授权
US08896106B2 Semiconductor packages having multiple lead frames and methods of formation thereof
有权
具有多个引线框架的半导体封装及其形成方法
- 专利标题： Semiconductor packages having multiple lead frames and methods of formation thereof
- 专利标题（中）： 具有多个引线框架的半导体封装及其形成方法
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申请号： US13544834申请日： 2012-07-09
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公开(公告)号： US08896106B2公开(公告)日： 2014-11-25
- 发明人: Ralf Otremba , Josef Hoeglauer , Juergen Schredl , Xaver Schloegel , Klaus Schiess
- 申请人： Ralf Otremba , Josef Hoeglauer , Juergen Schredl , Xaver Schloegel , Klaus Schiess
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L29/76
- IPC分类号： H01L29/76
摘要：
In accordance with an embodiment of the present invention, a semiconductor package includes a first lead frame having a first die paddle, and a second lead frame, which has a second die paddle and a plurality of leads. The second die paddle is disposed over the first die paddle. A semiconductor chip is disposed over the second die paddle. The semiconductor chip has a plurality of contact regions on a first side facing the second lead frame. The plurality of contact regions is coupled to the plurality of leads.
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