发明授权
- 专利标题: Cutting tool
- 专利标题(中): 切割用具
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申请号: US13637335申请日: 2011-03-25
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公开(公告)号: US08900336B2公开(公告)日: 2014-12-02
- 发明人: Mitsuru Hasegawa , Masahiro Waki
- 申请人: Mitsuru Hasegawa , Masahiro Waki
- 申请人地址: JP Kyoto
- 专利权人: Kyocera Corporation
- 当前专利权人: Kyocera Corporation
- 当前专利权人地址: JP Kyoto
- 优先权: JP2010-070397 20100325
- 国际申请: PCT/JP2011/057387 WO 20110325
- 国际公布: WO2011/118782 WO 20110929
- 主分类号: C23C14/00
- IPC分类号: C23C14/00 ; C23C14/06 ; C23C30/00 ; C23C14/34 ; C23C28/04 ; C23C28/00
摘要:
A cutting tool in which wear resistance is improved by suppressing sudden chipping on the flank face while suppressing oxidation of the coating layer on the rake face, and thereby has a long lifespan even under cutting conditions in which deposition and edge damage easily occur. In the cutting tool, a coating layer represented by Ti1-a-b-cAlaWbMc(C1-xNx), with M selected as at least one of silicon, yttrium, and a metal belonging to group 4, 5, or 6 on the periodic table, excluding titanium and tungsten, and 0.3≦a≦0.6, 0.01≦b≦0.2, 0≦c≦0.2, and 0≦x≦1, being provided on the surface of a main cutting tool body having a flank face and a rake face, and the content ratio of tungsten on the flank face is higher than the content ratio of tungsten on the rake face.
公开/授权文献
- US20130017026A1 CUTTING TOOL 公开/授权日:2013-01-17
信息查询
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