发明授权
- 专利标题： Printing phosphor on LED wafer using dry film lithography
- 专利标题（中）： 使用干膜光刻在LED晶片上印刷磷光体
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申请号： US13842127申请日： 2013-03-15
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公开(公告)号： US08900892B2公开(公告)日： 2014-12-02
- 发明人: Zequn Mei , Xianto Yan
- 申请人： LedEngin, Inc.
- 申请人地址： US CA San Jose
- 专利权人： LedEngin, Inc.
- 当前专利权人： LedEngin, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Kilpatrick Townsend and Stockton LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L33/50
摘要：
A method for depositing a layer of phosphor-containing material on a plurality of LED (light-emitting diode) dies on a wafer includes disposing a layer of dry photoresist film over a plurality of LED dies on a wafer, disposing a mask layer over the dry photoresist film, and patterning the dry photoresist film to form a plurality of openings in the dry photoresist film to expose a top surface of each of the LED dies. The method also includes depositing a phosphor-containing material on the exposed top surface of each the LED dies using a screen printing process, and removing the patterned dry photoresist film.
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