发明授权
- 专利标题: Bonding method and apparatus therefor
- 专利标题(中): 接合方法及其装置
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申请号: US12277863申请日: 2008-11-25
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公开(公告)号: US08901465B2公开(公告)日: 2014-12-02
- 发明人: Osamu Ohashi , Keiichi Minegishi , Yasunori Yoshida , Kouji Wada
- 申请人: Osamu Ohashi , Keiichi Minegishi , Yasunori Yoshida , Kouji Wada
- 申请人地址: JP Tokyo
- 专利权人: SMC Kabushiki Kaisha
- 当前专利权人: SMC Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2007-308147 20071129
- 主分类号: B23K13/01
- IPC分类号: B23K13/01 ; C04B37/00 ; B23K20/02
摘要:
A nitrogen gas tank, a rotary pump and a mechanical booster pump are connected to a bonding vessel that constitutes a bonding apparatus for carrying out diffusion bonding, the apparatus further comprising a pressure sensor. A nitrogen gas atmosphere is formed inside the bonding vessel, and under control operations of a control circuit, a nitrogen introduction rate is controlled so that a pressure is substantially fixed at a predetermined pressure between 3-105 Pa. At such a state, under the action of a rod of a hydraulic cylinder, a second electrode is brought into proximity with a first electrode, so that ultimately, a first object to be bonded and a second object to be bonded on the first electrode are pressed. Further, current is applied through the first electrode and the second electrode with respect to the first object to be bonded and the second object to be bonded.
公开/授权文献
- US20090139646A1 BONDING METHOD AND APPARATUS THEREFOR 公开/授权日:2009-06-04
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