Invention Grant
- Patent Title: Semiconductor nanoparticle assembly
- Patent Title (中): 半导体纳米颗粒组件
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Application No.: US13818849Application Date: 2011-03-15
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Publication No.: US08901535B2Publication Date: 2014-12-02
- Inventor: Masaru Takahashi , Kensaku Takanashi , Hideki Hoshino , Kohsuke Gonda , Motohiro Takeda , Noriaki Ohuchi
- Applicant: Masaru Takahashi , Kensaku Takanashi , Hideki Hoshino , Kohsuke Gonda , Motohiro Takeda , Noriaki Ohuchi
- Applicant Address: JP Tokyo JP Miyagi
- Assignee: Konica Minolta Medical & Graphic, Inc.,Tohoku University
- Current Assignee: Konica Minolta Medical & Graphic, Inc.,Tohoku University
- Current Assignee Address: JP Tokyo JP Miyagi
- Agency: Lucas & Mercanti, LLP
- Priority: JP2010-190352 20100827
- International Application: PCT/JP2011/055993 WO 20110315
- International Announcement: WO2012/026149 WO 20120301
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L33/06 ; C09K11/02 ; C09K11/88 ; C01B25/22
Abstract:
A semiconductor nanoparticle assembly including semiconductor nanoparticles having a core/shell structure, and wherein the semiconductor nanoparticles are bonded by means of amide bonds.
Public/Granted literature
- US20130153859A1 SEMICONDUCTOR NANOPARTICLE ASSEMBLY Public/Granted day:2013-06-20
Information query
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