发明授权
- 专利标题： Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes
- 专利标题（中）： 通过瞬态液相烧结和聚合物焊膏进行电子元件端接和组装
-
申请号： US13114126申请日： 2011-05-24
-
公开(公告)号： US08902565B2公开(公告)日： 2014-12-02
- 发明人: John E. McConnell , John Bultitude , Reggie Phillips , Robert Allen Hill , Garry L. Renner , Philip M. Lessner , Antony P. Chacko , Jeffrey Bell , Keith Brown
- 申请人： John E. McConnell , John Bultitude , Reggie Phillips , Robert Allen Hill , Garry L. Renner , Philip M. Lessner , Antony P. Chacko , Jeffrey Bell , Keith Brown
- 申请人地址： US SC Simpsonville
- 专利权人： Kemet Electronics Corporation
- 当前专利权人： Kemet Electronics Corporation
- 当前专利权人地址： US SC Simpsonville
- 代理机构： Perkins Law Firm, LLC
- 代理商 Joseph T. Guy
- 主分类号： H01G4/228
- IPC分类号： H01G4/228 ; H01G4/06 ; H01G4/30 ; B23K1/00 ; B23K1/20 ; B23K35/36 ; H01G4/232 ; B23K1/008 ; B23K35/02 ; H01G4/005 ; B23K1/005
摘要：
A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.
公开/授权文献
信息查询
