发明授权
- 专利标题: Thickness control of substrates
- 专利标题(中): 基材厚度控制
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申请号: US13669994申请日: 2012-11-06
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公开(公告)号: US08904822B2公开(公告)日: 2014-12-09
- 发明人: Philip Robert LeBlanc , Correy Robert Ustanik
- 申请人: Philip Robert LeBlanc , Correy Robert Ustanik
- 申请人地址: US NY Corning
- 专利权人: Corning Incorporated
- 当前专利权人: Corning Incorporated
- 当前专利权人地址: US NY Corning
- 代理商 Kevin M. Able
- 主分类号: C03B17/06
- IPC分类号: C03B17/06 ; C03B18/04
摘要:
A thickness of at least one preselected portion of a substrate, such as glass substrate for example, is controlled. A laser beam is directed to the at least one preselected portion of the substrate in a viscous state, thereby increasing a temperature and reducing a viscosity of the at least one preselected portion of the substrate in a viscous state sufficiently to cause the at least one preselected portion of the glass substrate to attain a desired thickness. The laser beam after it is generated can be directed to a reflecting surface from which the laser beam is reflected to the at least one preselected portion of the substrate in the viscous state. The substrate can comprise a glass ribbon produced in a downdraw glass forming process for example, and the laser beam can be directed onto a plurality of preselected portions of the glass ribbon.
公开/授权文献
- US20140123703A1 THICKNESS CONTROL OF SUBSTRATES 公开/授权日:2014-05-08
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