Invention Grant
US08906743B2 Semiconductor device with molded casing and package interconnect extending therethrough, and associated systems, devices, and methods
有权
具有模制外壳和延伸穿过其的封装互连件的半导体器件，以及相关联的系统，装置和方法
- Patent Title: Semiconductor device with molded casing and package interconnect extending therethrough, and associated systems, devices, and methods
- Patent Title (中): 具有模制外壳和延伸穿过其的封装互连件的半导体器件，以及相关联的系统，装置和方法
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Application No.: US13739331Application Date: 2013-01-11
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Publication No.: US08906743B2Publication Date: 2014-12-09
- Inventor: Chan Yoo , Todd O. Bolken
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/82 ; H01L23/495 ; H01L21/56
Abstract:
Methods for making semiconductor devices are disclosed herein. A method configured in accordance with a particular embodiment includes forming a spacer material on an encapsulant such that the encapsulant separates the spacer material from an active surface of a semiconductor device and at least one interconnect projecting away from the active surface. The method further includes molding the encapsulant such that at least a portion of the interconnect extends through the encapsulant and into the spacer material. The interconnect can include a contact surface that is substantially co-planar with the active surface of the semiconductor device for providing an electrical connection with the semiconductor device.
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