Invention Grant
- Patent Title: Methods and devices for packaging integrated circuits
- Patent Title (中): 集成电路封装的方法和装置
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Application No.: US13853645Application Date: 2013-03-29
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Publication No.: US08907465B2Publication Date: 2014-12-09
- Inventor: Kim-Yong Goh , Yiyi Ma , Wei Zhen Goh
- Applicant: STMicroelectronics Pte Ltd.
- Applicant Address: SG Singapore
- Assignee: STMicroelectronics Pte Ltd
- Current Assignee: STMicroelectronics Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: Gardere Wynne Sewell LLP
- Main IPC: H01L23/02
- IPC: H01L23/02 ; B81C1/00 ; B81B7/00

Abstract:
Methods and devices for packaging integrated circuits. A packaged device may include an integrated circuit, a first packaging component including a patterned surface, and a second packaging component. The patterned surface of the first packaging component may be adhesively coupled to a surface of the second packaging component or a surface of the integrated circuit. The integrated circuit may be at least partially enclosed between the first and second packaging components. A packaging method may include patterning a surface of a packaging component of an integrated circuit package. The surface of the packaging component may be for adhesively coupling to a second component to at least partially enclose an integrated circuit in the integrated circuit package.
Public/Granted literature
- US20140291782A1 METHODS AND DEVICES FOR PACKAGING INTEGRATED CIRCUITS Public/Granted day:2014-10-02
Information query
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