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公开(公告)号：US20140291782A1
公开(公告)日：2014-10-02
申请号：US13853645
申请日：2013-03-29
Applicant: STMICROELECTRONICS PTE LTD.
Inventor： Kim-Yong Goh , Yiyi Ma , Wei Zhen Goh
CPC classification number: B81B7/0058 , B81C2203/0109 , H01L2224/48091 , H01L2224/73265 , H01L2924/16151 , H01L2924/16152 , H01L2924/00014
Abstract: Methods and devices for packaging integrated circuits. A packaged device may include an integrated circuit, a first packaging component including a patterned surface, and a second packaging component. The patterned surface of the first packaging component may be adhesively coupled to a surface of the second packaging component or a surface of the integrated circuit. The integrated circuit may be at least partially enclosed between the first and second packaging components. A packaging method may include patterning a surface of a packaging component of an integrated circuit package. The surface of the packaging component may be for adhesively coupling to a second component to at least partially enclose an integrated circuit in the integrated circuit package.
Abstract translation: 集成电路封装的方法和装置。 封装的装置可以包括集成电路，包括图案化表面的第一包装部件和第二包装部件。 第一包装部件的图案化表面可以粘合地耦合到第二包装部件的表面或集成电路的表面。 集成电路可以至少部分地封装在第一和第二封装部件之间。 包装方法可以包括图案化集成电路封装的封装部件的表面。 包装部件的表面可以用于粘合地耦合到第二部件以至少部分地封装集成电路封装中的集成电路。
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公开(公告)号：US09679870B2
公开(公告)日：2017-06-13
申请号：US14565484
申请日：2014-12-10
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Yiyi Ma , Kim-Yong Goh , Xueren Zhang , Wei Zhen Goh
IPC: H01L23/00 , H01L23/482 , H01L23/495 , H01L23/31
CPC classification number: H01L24/85 , H01L23/3107 , H01L23/4822 , H01L23/49555 , H01L24/48 , H01L24/49 , H01L2224/48177 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: An integrated circuit (IC) device includes an IC and encapsulating material surrounding the IC. Leads are coupled to the IC and extend outwardly from sides of the encapsulating material, with each lead having three contiguous exposed segments with upper and lower bends defining a Z-shape. In another example, the leads include an upper horizontal segment, lower horizontal segment, and intermediate curved segment extending upwardly from the upper horizontal segment and downwardly to the lower horizontal segment.
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公开(公告)号：US08907465B2
公开(公告)日：2014-12-09
申请号：US13853645
申请日：2013-03-29
Applicant: STMicroelectronics Pte Ltd.
Inventor： Kim-Yong Goh , Yiyi Ma , Wei Zhen Goh
CPC classification number: B81B7/0058 , B81C2203/0109 , H01L2224/48091 , H01L2224/73265 , H01L2924/16151 , H01L2924/16152 , H01L2924/00014
Abstract: Methods and devices for packaging integrated circuits. A packaged device may include an integrated circuit, a first packaging component including a patterned surface, and a second packaging component. The patterned surface of the first packaging component may be adhesively coupled to a surface of the second packaging component or a surface of the integrated circuit. The integrated circuit may be at least partially enclosed between the first and second packaging components. A packaging method may include patterning a surface of a packaging component of an integrated circuit package. The surface of the packaging component may be for adhesively coupling to a second component to at least partially enclose an integrated circuit in the integrated circuit package.
Abstract translation: 集成电路封装的方法和装置。 封装的装置可以包括集成电路，包括图案化表面的第一包装部件和第二包装部件。 第一包装部件的图案化表面可以粘合地耦合到第二包装部件的表面或集成电路的表面。 集成电路可以至少部分地封装在第一和第二封装部件之间。 包装方法可以包括图案化集成电路封装的封装部件的表面。 包装部件的表面可以用于粘合地耦合到第二部件以至少部分地封装集成电路封装中的集成电路。
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