Invention Grant
- Patent Title: Methods of using a conductive composite material
- Patent Title (中): 使用导电复合材料的方法
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Application No.: US12641793Application Date: 2009-12-18
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Publication No.: US08907692B2Publication Date: 2014-12-09
- Inventor: Sebastien Marsanne , Boon Nam Poh , Samuel Devanandan
- Applicant: Sebastien Marsanne , Boon Nam Poh , Samuel Devanandan
- Applicant Address: SG Singapore
- Assignee: STMicroelectronics Asia Pacific Pte. Ltd.
- Current Assignee: STMicroelectronics Asia Pacific Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Gardere Wynne Sewell LLP
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/28

Abstract:
Composite materials having conductive properties are described for use in testing circuits and in manufacturing electrical switches. The composite materials described, when in an unstressed state, generally behave as insulators. However, when sufficient mechanical pressure is applied to portions of the composite materials, the portions to which the mechanical pressure is applied become increasingly conductive. Methods for testing a PCB using composite material switches are also disclosed. A sheet that includes a composite material may be used to test electrical functionality of various regions on a PCB by way of local pressure application. The sheet may be easily applied to and removed from the PCB. Additionally, in forming an electrical switch, a voltage applied to one or more actuating elements may be used to provide mechanical pressure to a composite material that is disposed between two conductive members. Application of a sufficient voltage allows for portions of the composite material to transition from an insulator to a conductor for providing an electrical pathway.
Public/Granted literature
- US20110147191A1 METHODS OF USING A CONDUCTIVE COMPOSITE MATERIAL Public/Granted day:2011-06-23
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