Invention Grant
- Patent Title: Interface module
- Patent Title (中): 接口模块
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Application No.: US11659124Application Date: 2005-06-29
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Publication No.: US08908385B2Publication Date: 2014-12-09
- Inventor: Claus Moessner , Burkhard Triess , Gert Maier , Peter Bach
- Applicant: Claus Moessner , Burkhard Triess , Gert Maier , Peter Bach
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102004038591 20040806
- International Application: PCT/EP2005/053053 WO 20050629
- International Announcement: WO2006/015907 WO 20060216
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/498 ; H05K3/34 ; H05K3/22 ; H05K1/14
Abstract:
An interface module has an integrated component for replacing a component on a circuit board, the terminal contacts on the bottom side of the interface module being designed as provided for the contacts of the component on the circuit board, the interface module being divided into an adaptor part as a base module and a protocol converter part as a tool access module.
Public/Granted literature
- US20090086443A1 Interface module Public/Granted day:2009-04-02
Information query
