发明授权
- 专利标题： Transparent substrate
- 专利标题（中）： 透明基材
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申请号： US13501044申请日： 2010-10-20
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公开(公告)号： US08911869B2公开(公告)日： 2014-12-16
- 发明人: Daisuke Hattori , Toshiyuki Iida , Takeshi Murashige , Takashi Yamaoka , Tatsuki Nagatsuka
- 申请人： Daisuke Hattori , Toshiyuki Iida , Takeshi Murashige , Takashi Yamaoka , Tatsuki Nagatsuka
- 申请人地址： JP Ibaraki-shi
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Ibaraki-shi
- 代理机构： Westerman, Hattori, Daniels & Adrain, LLP
- 优先权： JP2009-243135 20091022
- 国际申请： PCT/JP2010/068473 WO 20101020
- 国际公布： WO2011/049124 WO 20110428
- 主分类号： C03C17/34
- IPC分类号： C03C17/34 ; H01L31/0216 ; H02S30/00 ; C08G63/193 ; H01L31/042 ; C03C17/32 ; C09D167/02 ; B32B17/06
摘要：
The present invention provides a transparent substrate excellent in solvent crack resistance, toughness, heat resistance, and flexibility. A transparent substrate according to an embodiment of the present invention includes: an inorganic glass; and a first resin layer placed on at least one side of the inorganic glass, wherein: the first resin layer contains a resin compound having a weight-average molecular weight in terms of polystyrene of 8×104 to 100×104; and no solvent crack occurs when a mixed solvent containing 20 wt % to 95 wt % of at least one kind of solvent selected from the group consisting of acetone, N-methylpyrrolidone, dimethyl sulfoxide, and N,N-dimethylformamide is brought into contact with the substrate.
公开/授权文献
- US20120202074A1 TRANSPARENT SUBSTRATE 公开/授权日：2012-08-09