Invention Grant
- Patent Title: Through via package
- Patent Title (中): 通过包装
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Application No.: US13291788Application Date: 2011-11-08
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Publication No.: US08922013B2Publication Date: 2014-12-30
- Inventor: How Yuan Hwang , Kah Wee Gan
- Applicant: How Yuan Hwang , Kah Wee Gan
- Applicant Address: SG Singapore
- Assignee: STMicroelectronics Pte Ltd.
- Current Assignee: STMicroelectronics Pte Ltd.
- Current Assignee Address: SG Singapore
- Agency: Seed IP Law Group PLLC
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H01L23/00 ; H01L21/48 ; H01L23/538
Abstract:
An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side.
Public/Granted literature
- US20130113098A1 THROUGH VIA PACKAGE Public/Granted day:2013-05-09
Information query
IPC分类:
