发明授权
- 专利标题： Circuit board and method for manufacturing circuit board
- 专利标题（中）： 电路板及制造电路板的方法
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申请号： US13404173申请日： 2012-02-24
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公开(公告)号： US08923008B2公开(公告)日： 2014-12-30
- 发明人: Kazuhiro Yoshikawa , Toshiki Furutani
- 申请人： Kazuhiro Yoshikawa , Toshiki Furutani
- 申请人地址： JP Ogaki-shi
- 专利权人： Ibiden Co., Ltd.
- 当前专利权人： Ibiden Co., Ltd.
- 当前专利权人地址： JP Ogaki-shi
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K7/12 ; H01L21/56 ; H01L25/10 ; H01L23/31
摘要：
A circuit board includes an insulation layer having a first surface and a second surface on the opposite side of the first surface, an electronic component positioned in the insulation layer and having a terminal, a conductive pattern formed on the second surface of the insulation layer and electrically connected to the terminal, and an insulative film formed on the second surface of the insulation layer and on the conductive pattern. The terminal of the electronic component has a protruding portion which protrudes from the second surface of the insulation layer.
公开/授权文献
- US20120228012A1 CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD 公开/授权日：2012-09-13
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