Invention Grant
- Patent Title: Substrate with built-in electronic component
- Patent Title (中): 基板内置电子元器件
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Application No.: US13909880Application Date: 2013-06-04
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Publication No.: US08923009B2Publication Date: 2014-12-30
- Inventor: Tatsuro Sawatari , Yuichi Sugiyama , Hiroshi Nakamura , Masaki Naganuma , Tetsuo Saji
- Applicant: Taiyo Yuden Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2012-247417 20121109
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/00 ; H05K7/00 ; H05K1/16 ; H05K1/02
Abstract:
In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.
Public/Granted literature
- US20140133120A1 SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT Public/Granted day:2014-05-15
Information query
