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公开(公告)号：US09451690B2
公开(公告)日：2016-09-20
申请号：US13869335
申请日：2013-04-24
发明人： Tetsuo Saji , Hiroshi Nakamura
CPC分类号： H05K1/0243 , H01L24/19 , H01L24/24 , H01L2223/6677 , H01L2224/04105 , H01L2224/16225 , H01L2224/73267 , H01L2924/19105 , H05K1/0233 , H05K1/0253 , H05K1/185
摘要： A multilayer circuit substrate has a high frequency switch embedded therein. In the multilayer circuit substrate, a first conductive layer that faces a main surface of the high frequency switch through an insulating layer has circuit patterns formed therein so as to be connected to input/output terminals through via conductors. The first conductive layer has an opening pattern in which a ground conductor is not present in a region that faces the main surface of the high frequency switch and that is outside of the circuit patterns. In a third conductive layer disposed outer side of the first conductive layer with respect to the high frequency switch, a ground conductor is formed at least in a region where the main surface of the high frequency switch is projected in the thickness direction.
摘要翻译： 多层电路衬底具有嵌入其中的高频开关。 在多层电路基板中，通过绝缘层面向高频开关的主表面的第一导电层具有形成在其中的电路图案，以便通过通孔导体连接到输入/输出端子。 第一导电层具有开口图案，其中接地导体不存在于面向高频开关的主表面并且在电路图案之外的区域中。 在相对于高频开关设置在第一导电层的外侧的第三导电层中，至少在高频开关的主表面沿厚度方向突出的区域中形成接地导体。
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公开(公告)号：US09018039B2
公开(公告)日：2015-04-28
申请号：US14517424
申请日：2014-10-17
发明人： Eiji Mugiya , Takehiko Kai , Masaya Shimamura , Tetsuo Saji , Hiroshi Nakamura
CPC分类号： H01L23/552 , H01L21/52 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L24/97 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/00
摘要： A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.
摘要翻译： 电路模块包括电路基板，至少一个安装部件，密封体和屏蔽件。 电路基板包括安装表面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有第一密封体部分和具有第二厚度大于第一厚度的第二密封体部分。 屏蔽罩覆盖密封体，并且具有形成在第一密封体部分上并具有第三厚度的第一屏蔽部分和形成在第二密封体部分上并且具有小于第三厚度的第四厚度的第二屏蔽部分。 第四厚度和第二厚度之和等于第一厚度和第三厚度之和。
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公开(公告)号：US08923009B2
公开(公告)日：2014-12-30
申请号：US13909880
申请日：2013-06-04
CPC分类号： H05K1/185 , H05K1/0213 , H05K1/0271 , H05K1/0298 , H05K2201/09063 , H05K2203/1178
摘要： In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.
摘要翻译： 在分别与具有穿过其的存储部分的芯层最靠近的第一导电层和第三导电层中，形成四个第一穿透孔和四个第一穿透孔，以与存储部分的开口边缘的一部分重叠 其分别投影到第一导电层和第三导电层上。
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公开(公告)号：US20140349596A1
公开(公告)日：2014-11-27
申请号：US14455696
申请日：2014-08-08
发明人： Tetsuo Saji , Hiroshi Nakamura
摘要： Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range.
摘要翻译： 提供了可以防止发送信号到达接收电路并且可以实现高安装密度的高频模块。 用于第一频带的第一双工器安装在电路基板上，并且构成用于第二频带的第二双工器的第二发送滤波器和第二接收滤波器被嵌入在电路基板中。 第二透射滤光器和第二接收滤光器在与电路基板的厚度方向突出形成的突起区域的至少一部分重叠的位置嵌入电路基板。 第一频带和第二频带彼此分开至少规定的频率范围。
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公开(公告)号：US08890309B1
公开(公告)日：2014-11-18
申请号：US14102172
申请日：2013-12-10
发明人： Eiji Mugiya , Takehiko Kai , Masaya Shimamura , Tetsuo Saji , Hiroshi Nakamura
IPC分类号： H01L23/12 , H01L23/02 , H01L21/52 , H01L23/552 , H01L21/56
CPC分类号： H01L23/552 , H01L21/52 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L24/97 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/00
摘要： A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.
摘要翻译： 电路模块包括电路基板，至少一个安装部件，密封体和屏蔽件。 电路基板包括安装表面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有第一密封体部分和具有第二厚度大于第一厚度的第二密封体部分。 屏蔽罩覆盖密封体，并且具有形成在第一密封体部分上并具有第三厚度的第一屏蔽部分和形成在第二密封体部分上并且具有小于第三厚度的第四厚度的第二屏蔽部分。 第四厚度和第二厚度之和等于第一厚度和第三厚度之和。
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公开(公告)号：US20140051369A1
公开(公告)日：2014-02-20
申请号：US14056758
申请日：2013-10-17
发明人： Tetsuo Saji , Hiroshi Nakamura
IPC分类号： H04B1/40
摘要： Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range.
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公开(公告)号：US09985681B2
公开(公告)日：2018-05-29
申请号：US15610296
申请日：2017-05-31
发明人： Tetsuo Saji , Yuki Endo , Nobuaki Matsuo
CPC分类号： H04B1/44 , H04B1/0057 , H04B1/0064 , H04B15/02
摘要： A module comprising: a first transmit filter that passes a transmission signal of a first band; a first receive filter that passes a reception signal of the first band; a second transmit filter that passes a transmission signal of a second band; a second receive filter that passes a reception signal of the second band; a third transmit filter that passes a transmission signal of a third band; and a third receive filter that passes a reception signal of the third band, wherein a transmit band of the first band overlaps with at least a part of a receive band of the second band, a receive band of the third band does not overlap with the transmit band of the first band or a transmit band of the second band, and the third receive filter is located between the first receive filter and the second receive filter.
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公开(公告)号：US09894816B2
公开(公告)日：2018-02-13
申请号：US15115868
申请日：2015-02-04
发明人： Tetsuo Saji , Yohei Ichikawa , Hiroshi Nakamura
CPC分类号： H05K9/0024 , H01L23/00 , H01L23/28 , H01L23/3121 , H01L23/552 , H01L2924/0002 , H05K1/0216 , H05K1/185 , H05K2201/10371 , H05K2201/10522 , H01L2924/00
摘要： One object is to prevent electromagnetic wave interference between electronic components with restricted increase of the size of a circuit module. A circuit module according to an embodiment includes a circuit board, a plurality of electronic components provided on the circuit board, a resin mold provided on the circuit board so as to seal the plurality of electronic components in an insulating manner, a conductive shield covering the top surface and the side surfaces of the resin mold, and a plurality of conductive poles having a columnar shape provided in the resin mold and connecting the top surface of the conductive shield and the ground of the circuit board. The resonance caused by frequencies equal to or less than a predetermined maximum usable frequency is restricted.
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公开(公告)号：US09866265B2
公开(公告)日：2018-01-09
申请号：US14063754
申请日：2013-10-25
发明人： Tetsuo Saji , Hiroshi Nakamura
CPC分类号： H04B1/48 , H01L23/5384 , H01L23/5386 , H01L23/5389 , H01L24/19 , H01L2224/04105 , H01L2224/16225 , H01L2224/24137 , H01L2224/73267 , H01L2924/19105 , H04B1/0458 , H04B1/18
摘要： A high frequency circuit module is provided with: a multilayer circuit substrate; a first high frequency switch that switches connection of an antenna; a transmission filter; and reception filters. Either the transmission filter or the reception filters, or both, and the first high frequency switch are embedded in the multilayer circuit substrate, and ground conductors are formed in a conductive layer facing embedded electronic components.
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公开(公告)号：US09282632B2
公开(公告)日：2016-03-08
申请号：US13861907
申请日：2013-04-12
发明人： Tetsuo Saji , Hiroshi Nakamura
CPC分类号： H05K1/0253 , H01P3/088 , H05K1/0227 , H05K1/185 , H05K3/4602 , H05K2201/09245 , H05K2201/09336 , H05K2201/09727
摘要： A multilayer circuit substrate includes: a first conductor layer in which first transmission lines and a second transmission line are formed; a second conductive layer facing the first conductive layer through an insulating layer; and a third conductive layer that faces the second conductive layer through an insulating layer and that has a bypass line formed therein. The bypass line is electrically connected to the second transmission line of the first conductive layer through via conductors and such that the second transmission line and the first transmission lines intersect with each other. In the second conductive layer, a ground conductor is formed at least in a position that faces the bypass line, and the first transmission lines are made narrower at the intersection with the second transmission line than other portions.
摘要翻译： 多层电路基板包括：第一导体层，其中形成有第一传输线和第二传输线; 通过绝缘层面对所述第一导电层的第二导电层; 以及通过绝缘层面向所述第二导电层并且在其中形成有旁路线的第三导电层。 旁通线路通过通孔导体与第一导电层的第二传输线电连接，使得第二传输线与第一传输线相互交叉。 在第二导电层中，至少形成面向旁路线的位置的接地导体，并且使第一传输线在与第二传输线的交点处比其它部分更窄。
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