Invention Grant
US08927339B2 Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
有权
制造具有凸块/基底/法兰散热器和积聚电路的热增强型半导体组件的方法
- Patent Title: Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
- Patent Title (中): 制造具有凸块/基底/法兰散热器和积聚电路的热增强型半导体组件的方法
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Application No.: US13299472Application Date: 2011-11-18
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Publication No.: US08927339B2Publication Date: 2015-01-06
- Inventor: Charles W. C. Lin , Chia-Chung Wang
- Applicant: Charles W. C. Lin , Chia-Chung Wang
- Applicant Address: TW Taipei
- Assignee: Bridge Semiconductor Corporation
- Current Assignee: Bridge Semiconductor Corporation
- Current Assignee Address: TW Taipei
- Agency: Bacon & Thomas, PLLC
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L23/00 ; H01L21/48 ; H01L23/13 ; H01L23/367 ; H01L23/498 ; H01L23/538
Abstract:
A method of making a semiconductor assembly that includes a semiconductor device, a heat spreader, an adhesive and a build-up circuitry is disclosed. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry includes a dielectric layer and conductive traces on the semiconductor device and the flange. The conductive traces provide signal routing for the semiconductor device.
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