Invention Grant
- Patent Title: Semiconductor device and method of forming epitaxial layer
- Patent Title (中): 半导体器件和形成外延层的方法
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Application No.: US14260294Application Date: 2014-04-24
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Publication No.: US08927376B2Publication Date: 2015-01-06
- Inventor: Chin-I Liao , Teng-Chun Hsuan , Chin-Cheng Chien
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/66 ; H01L21/02 ; H01L29/165 ; H01L27/088 ; H01L21/8234 ; H01L29/78

Abstract:
A method for forming epitaxial layer is disclosed. The method includes the steps of providing a semiconductor substrate, and forming an undoped first epitaxial layer in the semiconductor substrate. Preferably, the semiconductor substrate includes at least a recess, the undoped first epitaxial layer has a lattice constant, a bottom thickness, and a side thickness, in which the lattice constant is different from a lattice constant of the semiconductor substrate and the bottom thickness is substantially larger than or equal to the side thickness.
Public/Granted literature
- US20140235038A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING EPITAXIAL LAYER Public/Granted day:2014-08-21
Information query
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