Invention Grant
- Patent Title: Package-on-package process for applying molding compound
- Patent Title (中): 封装包装方法，适用于模塑料
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Application No.: US13118108Application Date: 2011-05-27
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Publication No.: US08927391B2Publication Date: 2015-01-06
- Inventor: Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu
- Applicant: Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/56 ; H01L25/00 ; H01L25/10 ; H01L23/00 ; H01L23/31 ; H01L23/498
Abstract:
A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.
Public/Granted literature
- US20120299181A1 Package-on-Package Process for Applying Molding Compound Public/Granted day:2012-11-29
Information query
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