Invention Grant
- Patent Title: Resin composition and molded article
- Patent Title (中): 树脂组合物和模制品
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Application No.: US14072360Application Date: 2013-11-05
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Publication No.: US08927629B2Publication Date: 2015-01-06
- Inventor: Daisuke Sawai , Takayasu Nagai , Hiroshi Inada , Akio Tamura
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-110099 20110517
- Main IPC: C08L1/32
- IPC: C08L1/32 ; C08L69/00 ; C08K5/00 ; C08K5/105 ; C08K5/527

Abstract:
A cellulose acetate resin composition having a cellulose acetate ether compound and a stabilizer; the cellulose acetate ether compound comprising a specific atomic group, the specific atomic group being introduced into a cellulose acetate through an ether group derived from a hydroxyl group, the specific atomic group being introduced with a substitution degree of 0.01 or more; the cellulose acetate comprising residual hydroxyl group in a substitution degree of 0.3 to 1.0, the stabilizer being at least one selected from the group consisting of a phosphite compound, a hindered phenol compound, a hindered amine compound, and a sulfur compound.
Public/Granted literature
- US20140058022A1 RESIN COMPOSITION AND MOLDED ARTICLE Public/Granted day:2014-02-27
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