Invention Grant
- Patent Title: Insert molded cowling structures
- Patent Title (中): 插入模制整流罩结构
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Application No.: US13607440Application Date: 2012-09-07
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Publication No.: US08927881B2Publication Date: 2015-01-06
- Inventor: Michael B. Wittenberg , Sawyer I. Cohen , Jared M. Kole , Shayan Malek , David A. Pakula , Ashutosh Y. Shukla
- Applicant: Michael B. Wittenberg , Sawyer I. Cohen , Jared M. Kole , Shayan Malek , David A. Pakula , Ashutosh Y. Shukla
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group
- Agent Kandall P. Woodruff
- Main IPC: H05K7/14
- IPC: H05K7/14

Abstract:
Electronic devices may be provided with electronic components and cowling structures that secure the electronic components. A cowling structure may include a metal portion and an insulating portion that has been insert-molded onto the metal portion. The metal portion and the insert-molded insulating portion may each have an opening that receives a screw. The screws may pass through the respective opening and attach to a substrate. The substrate may be a transparent cover layer for a device display. The cowling structure may press the electronic components against the transparent substrate layer. The device may include an antenna. The insert-molded insulating portion may extend from an edge of the metal portion in the direction of the antenna. The insert-molded insulating portion may prevent one of the screws from forming an electrical connection with the metal portion.
Public/Granted literature
- US20140071651A1 Insert Molded Cowling Structures Public/Granted day:2014-03-13
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