发明授权
- 专利标题: Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate
- 专利标题(中): 支撑板的安装装置和安装装置以及支撑板的安装方法
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申请号: US13369448申请日: 2012-02-09
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公开(公告)号: US08931535B2公开(公告)日: 2015-01-13
- 发明人: Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
- 申请人: Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
- 申请人地址: JP Kanagawa
- 专利权人: Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人: Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址: JP Kanagawa
- 代理机构: Carrier Blackman & Associates, P.C.
- 代理商 Joseph P. Carrier; William D. Blackman
- 优先权: JP2005-352594 20051206
- 主分类号: B32B37/10
- IPC分类号: B32B37/10 ; B32B38/18 ; H01L21/68 ; H01L21/687 ; B32B37/00
摘要:
An attaching method for attaching a support plate to a surface of a substrate with an adhesive involves the steps of applying an adhesive to the surface of the substrate, heating and thereafter cooling the substrate, positioning centers of the substrate and the supporting plate to coincide with each other, and forming a layered structure by pushing the supporting plate onto the substrate with the adhesive therebetween in a pressure-reduced atmosphere. In the positioning step, after the supporting late has been placed on the substrate, it is possible to finely adjust the alignment of the supporting plate and a semiconductor wafer when attached because the adhesive is applied to the surface of the substrate, and thereafter the substrate is heated and cooled.