发明授权
US08933550B2 Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors
有权
具有多个芯片和电容器的混合半导体封装结构的结构
- 专利标题： Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors
- 专利标题（中）： 具有多个芯片和电容器的混合半导体封装结构的结构
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申请号： US13442757申请日： 2012-04-09
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公开(公告)号： US08933550B2公开(公告)日： 2015-01-13
- 发明人: Yan Xun Xue , Anup Bhalla , Jun Lu
- 申请人： Yan Xun Xue , Anup Bhalla , Jun Lu
- 申请人地址： US CA Sunnyvale
- 专利权人： Alpha & Omega Semiconductor, Inc.
- 当前专利权人： Alpha & Omega Semiconductor, Inc.
- 当前专利权人地址： US CA Sunnyvale
- 代理机构： CH Emily LLC
- 代理商 Chein-Hwa Tsao
- 主分类号： H01L23/22
- IPC分类号： H01L23/22 ; H01L29/40 ; H01L23/495 ; H01L23/00
摘要：
A semiconductor package for power converter application comprises a low-side MOSFET chip and a high-side MOSFET chip stacking one over the other. The semiconductor package may further enclose a capacitor whereas the capacitor may be a discrete component or an integrated component on chip level with the low-side MOSFET. The semiconductor package may further comprise a PIC chip to provide a complete power converter on semiconductor chip assembly package level.
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