Invention Grant
US08933722B2 Measuring device and a method for measuring a chip-to-chip-carrier connection
有权
测量装置和测量芯片到芯片 - 载体连接的方法
- Patent Title: Measuring device and a method for measuring a chip-to-chip-carrier connection
- Patent Title (中): 测量装置和测量芯片到芯片 - 载体连接的方法
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Application No.: US13222121Application Date: 2011-08-31
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Publication No.: US08933722B2Publication Date: 2015-01-13
- Inventor: Ming Xue
- Applicant: Ming Xue
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: G01R31/02
- IPC: G01R31/02 ; H01H31/02 ; G01R31/312 ; G01R31/28

Abstract:
A measuring device is provided, the measuring device including: a power supply to provide electric power to a chip via at least one of a chip connection and a chip-carrier connection; a chip arrangement receiving portion configured to receive a chip arrangement, the chip arrangement including a chip and a plurality of chip-to-chip-carrier connections; a detection portion including: a plate; a detection circuit coupled to the plate and configured to detect an electrical signal from the plate; wherein the plate is configured such that it covers at least part of the chip arrangement; and wherein at least one chip-carrier connection is in electrical connection with the plate.
Public/Granted literature
- US20130049792A1 MEASURING DEVICE AND A METHOD FOR MEASURING A CHIP-TO-CHIP-CARRIER CONNECTION Public/Granted day:2013-02-28
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