Invention Grant
- Patent Title: Super capacitor casing and supercapacitor embedded device
- Patent Title (中): 超级电容器外壳和超级电容器嵌入式设备
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Application No.: US13709635Application Date: 2012-12-10
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Publication No.: US08934255B2Publication Date: 2015-01-13
- Inventor: Hyo-Jae Bang , Jung-Hyeon Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Ellsworth IP Group PLLC
- Priority: KR10-2009-0020426 20090310
- Main IPC: H05K7/00
- IPC: H05K7/00 ; G06F1/18
Abstract:
A casing to support a solid state device SSD therein and super capacitors therein to be electronically connected together.
Public/Granted literature
- US20140160660A1 SUPER CAPACITOR CASING AND SUPERCAPACITOR EMBEDDED DEVICE Public/Granted day:2014-06-12
Information query
