摘要:
A method of forming external terminals of a package is provided in which a package substrate may be fixed, an edge portion of the package substrate may be supported to prevent the edge portion of the package substrate from being upwardly bent, a mask having openings may be arranged on the package substrate, and the external terminals may be supplied to the package substrate through the openings of the mask. The supporting portion may downwardly press the edge portion of the package substrate so that the edge portion of the package substrate may not be upwardly bent. As a result, the external terminals on the package substrate may have a uniform thickness.
摘要:
An erase system and method of a nonvolatile memory device includes supplying an erase voltage to a plurality of memory cells of a nonvolatile memory, performing a read operation with a read voltage to word lines of the plurality of memory cells, and performing an erase verification operation with an erase verification voltage to at least one of the word lines of the plurality of memory cells, the erase verification voltage lower than the read voltage.
摘要:
A user system is provided which includes a storage device and an auxiliary power device configured to supply a power to the storage device, wherein the auxiliary power device includes a first one direction device configured to supply a supply voltage from an external power supply to the storage device, a charging unit configured to be charged by the external power supply, a second one direction device configured to selectively supply an output voltage of the charging unit to the storage device, a voltage detector configured to detect a level of the output voltage of the charging unit and to output a first control signal to the storage device, and a switching unit connected between the charging unit and the second one direction device and configured to operate in response to a second control signal from the storage device.
摘要:
A semiconductor memory device includes at least one memory cell connected to an internal voltage line that receives a cell power supply voltage and a write assist circuit connected to the internal voltage line. The write assist circuit lowers a level of the cell power supply voltage to a target level during a first period of a write operation on the memory cell and maintains the level of the cell power supply voltage at the target level during a second period of the write operation based on a write assist control signal. The second period succeeds the first period.
摘要:
A method of fabricating semiconductor devices having metal gate electrodes includes forming an insulating layer on a semiconductor substrate having a first region and a second region. The insulating layer is formed to include an interlayer insulating layer and a gate insulation layer. The interlayer insulating layer has first and second grooves respectively disposed in the first and second regions, and the gate insulation layer covers at least bottom surfaces of the first and second grooves. A laminated metal layer is formed on the substrate having the insulating layer. A planarization layer having non-photo sensitivity is formed on the laminated metal layer. The planarization layer in the first region is selectively removed using a dry etching process to expose the laminated metal layer in the first region and to form a planarization layer pattern covering the laminated metal layer in the second region.
摘要:
A semiconductor chip package eliminates and minimizes a power noise generated from a voltage generation circuit in the semiconductor chip package includes an integrated circuit chip with a voltage generation circuit that receives an external voltage to generate a supply voltage to be used in an internal circuit and a connection terminal connected to an output node of the voltage generation circuit, and a mounting substrate including a noise eliminator electrically connected to the connection terminal to reduce a power noise of the supply voltage and a mounting substrate to mount the integrated circuit chip to package the integrated circuit chip as the semiconductor chip package.
摘要:
A semiconductor device includes a substrate including an active region having an isolated shape and a field region. A gate insulation layer is provided on an upper surface of the active region of the substrate. A gate electrode is provided on the gate insulation layer and spaced apart from the boundary of the active region to cover the middle portion of the active region. An impurity region is provided under a surface of the active region that is exposed by the gate electrode.
摘要:
A method of operating a memory device includes changing a first read voltage, which determines a first voltage state or a second voltage state, to a voltage within a first range and determining the voltage as a first select read voltage, and changing a second read voltage, which is used to determine whether the data stored in the memory cells is a third different voltage state or a fourth different voltage state, to a voltage within a second different range and determining the voltage as a second select read voltage. The first voltage state overlaps the second voltage. The third voltage state overlaps the fourth voltage state. A difference between a voltage at an intersection of the third and fourth voltage states and the second read voltage is greater than a difference between a voltage at an intersection of the first and second voltage states and the first read voltage.
摘要:
Described is a memory controller interfacing with a host and a nonvolatile memory. The memory controller may include a buffer unit configured to store an input address table and a first hot address table; and a processing unit configured to judge whether an address from the host coincides with one of addresses stored in the input address table and to store the address from the host in the first hot address table according to the judgment.