发明授权
US08936742B2 Integratable assisted cooling system for precision extrusion deposition in the fabrication of 3D scaffolds
有权
可集成的辅助冷却系统，用于在3D支架的制造中进行精密挤压沉积
- 专利标题： Integratable assisted cooling system for precision extrusion deposition in the fabrication of 3D scaffolds
- 专利标题（中）： 可集成的辅助冷却系统，用于在3D支架的制造中进行精密挤压沉积
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申请号： US13243226申请日： 2011-09-23
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公开(公告)号： US08936742B2公开(公告)日： 2015-01-20
- 发明人: Wei Sun , Qudus Hamid
- 申请人： Wei Sun , Qudus Hamid
- 申请人地址： US PA Philadelphia
- 专利权人： Drexel University
- 当前专利权人： Drexel University
- 当前专利权人地址： US PA Philadelphia
- 代理机构： Saul Ewing LLP
- 代理商 Kathryn Doyle; Brian R. Landry
- 主分类号： B29C47/88
- IPC分类号： B29C47/88 ; B29C35/04 ; B29C67/00 ; B29C35/16 ; B29C47/00
摘要：
The present invention relates to an integrated Assisting Cooling (AC) device, system and method for use with PED devices, allowing use of biopolymers having higher melting points in the fabrication of 3D scaffolds. The AC device cools the filament as it is extruding from the nozzle via low flow convective cooling. The AC device allows for cooling in the +/− direction of motion on an XY plane. The AC device elevates with the material delivery chamber. The AC device allows for scaffold fabrication at applied temperatures as high as about 250° C.