Invention Grant
- Patent Title: Solderless surface mount fuse
- Patent Title (中): 无焊表面安装保险丝
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Application No.: US12410596Application Date: 2009-03-25
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Publication No.: US08937524B2Publication Date: 2015-01-20
- Inventor: Conrado de Leon , Gordon T. Dietsch , Edgardo Olan , John Emannuel Semana , John Song , Stephen J. Whitney
- Applicant: Conrado de Leon , Gordon T. Dietsch , Edgardo Olan , John Emannuel Semana , John Song , Stephen J. Whitney
- Applicant Address: US IL Chicago
- Assignee: Littelfuse, Inc.
- Current Assignee: Littelfuse, Inc.
- Current Assignee Address: US IL Chicago
- Agency: Kacvinsky Daisak Bluni PLLC
- Main IPC: H01H85/46
- IPC: H01H85/46 ; H01H85/04 ; H01H85/00 ; H01H69/02 ; H01H85/041 ; H01H85/08 ; H01H85/055 ; H01H85/157 ; H01H85/165 ; H05K3/34
Abstract:
A surface mount fuse in one embodiment includes an insulative body, first and second conductive and caps attached to the insulative body, each end cap defining an aperture, and a fuse element extending (i) through the insulative body and the apertures and (ii) along outside surfaces of the first and second conductive end caps in such a way that solder used to attach the first and second conductive end caps to an external medium also fastens the fuse element to the first and second end caps.
Public/Granted literature
- US20100245025A1 SOLDERLESS SURFACE MOUNT FUSE Public/Granted day:2010-09-30
Information query
