Invention Grant
- Patent Title: Opto-electronic system having flip-chip substrate mounting
- Patent Title (中): 具有倒装芯片基板安装的光电系统
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Application No.: US13569364Application Date: 2012-08-08
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Publication No.: US08938136B2Publication Date: 2015-01-20
- Inventor: Chung-Yi Su , Tak Kui Wang
- Applicant: Chung-Yi Su , Tak Kui Wang
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/36

Abstract:
An opto-electronic system includes a system substrate, a lens, a bridging device, and an opto-electronic chip mounted in a cavity in the system substrate. The bridging device, which can be another chip, a lens block, or an interposer, is mounted in flip-chip orientation to the opto-electronic chip and provides electrical interconnection with signal conductors of the system substrate.
Public/Granted literature
- US20140044388A1 OPTO-ELECTRONIC SYSTEM HAVING FLIP-CHIP SUBSTRATE MOUNTING Public/Granted day:2014-02-13
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