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US08938136B2 Opto-electronic system having flip-chip substrate mounting 有权
具有倒装芯片基板安装的光电系统

Opto-electronic system having flip-chip substrate mounting
Abstract:
An opto-electronic system includes a system substrate, a lens, a bridging device, and an opto-electronic chip mounted in a cavity in the system substrate. The bridging device, which can be another chip, a lens block, or an interposer, is mounted in flip-chip orientation to the opto-electronic chip and provides electrical interconnection with signal conductors of the system substrate.
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