公开(公告)号：US08938136B2

公开(公告)日：2015-01-20

申请号：US13569364

申请日：2012-08-08

申请人： Chung-Yi Su ,  Tak Kui Wang

发明人： Chung-Yi Su ,  Tak Kui Wang

IPC分类号： G02B6/12 ,  G02B6/36

CPC分类号： G02B6/428 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/425 ,  G02B6/4269 ,  H01L31/024

摘要： An opto-electronic system includes a system substrate, a lens, a bridging device, and an opto-electronic chip mounted in a cavity in the system substrate. The bridging device, which can be another chip, a lens block, or an interposer, is mounted in flip-chip orientation to the opto-electronic chip and provides electrical interconnection with signal conductors of the system substrate.

摘要翻译： 光电系统包括系统基板，透镜，桥接装置和安装在系统基板中的空腔中的光电芯片。 可以是另一芯片，透镜块或插入件的桥接装置以倒装芯片方向安装到光电芯片，并提供与系统基板的信号导体的电互连。

公开(公告)号：US08403568B2

公开(公告)日：2013-03-26

申请号：US12815643

申请日：2010-06-15

申请人： Tak Kui Wang ,  Ronald T. Kaneshiro ,  Chung-Yi Su ,  Craig T. Cummings ,  Ye Chen ,  Bing Shao

发明人： Tak Kui Wang ,  Ronald T. Kaneshiro ,  Chung-Yi Su ,  Craig T. Cummings ,  Ye Chen ,  Bing Shao

IPC分类号： G02B6/36 ,  G02B6/00

CPC分类号： G02B6/3817

摘要： In a connector system, a first connector is mechanically and optically mateable with a second connector to form one or more optical signal communication links. A wiping cleaner is included on at least one of the first and second connectors for cleaning an optical port of the other of the first and second connectors when the connectors are plugged together. The first and second connectors can further be electrically mateable to provide both optical and electrical signal communication links.

公开(公告)号：US20110249947A1

公开(公告)日：2011-10-13

申请号：US12758085

申请日：2010-04-12

申请人： Tak Kui Wang ,  Chung-yi Su

发明人： Tak Kui Wang ,  Chung-yi Su

IPC分类号： G02B6/36

CPC分类号： H05K3/366 ,  G02B6/3817 ,  G02B6/4246 ,  H05K1/0274 ,  H05K1/0281 ,  H05K3/363 ,  H05K2201/09181 ,  H05K2201/10121 ,  H05K2201/10545

摘要： An opto-electronic communication module includes a module body and a circuit board having an edge with conductive castellations extending between opposing surfaces of the circuit board. At least one opto-electronic communication device, such as an opto-electronic light source or an opto-electronic light receiver, is mounted on a surface of the circuit board in an orientation in which its optical signal communication axis is normal to the surface of the circuit board and aligned with an optical signal communication port of the module body.

摘要翻译： 光电子通信模块包括模块主体和电路板，该电路板具有在电路板的相对表面之间延伸的具有导电堰的边缘。 至少一个光电子通信装置，例如光电子光源或光电子光接收器，被安装在电路板的表面上，其方向是将光信号通信轴垂直于 电路板并与模块主体的光信号通信端口对准。

公开(公告)号：US06412751B1

公开(公告)日：2002-07-02

申请号：US09553910

申请日：2000-04-20

申请人： Tak Kui Wang

发明人： Tak Kui Wang

IPC分类号： F16K31145

CPC分类号： F15C5/00 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0055 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/008 ,  F16K2099/0084

摘要： An improved micro-machined valve assembly includes a valve diaphragm that will not adhere to a valve seat during elevated temperature operation. In one embodiment, a portion of the diaphragm that is susceptible to adhering to the valve seat at elevated temperature is removed in the region where the diaphragm contacts the valve seat. In another embodiment, the valve diaphragm includes a metal layer applied to the portion of the diaphragm that comes into contact with the valve seat during operation of the valve. The metal layer extends the operating temperature of the valve by preventing adhesion of the diaphragm to the valve seat during high temperature operation. Selection of an appropriate material for the metal layer can improve chemical inertness of valve, thereby reducing the possibility that the material flowing through the valve will react with the metal.

摘要翻译： 改进的微加工阀组件包括在高温操作期间不会粘附到阀座的阀膜。 在一个实施例中，在隔膜接触阀座的区域中去除了易于在高温下粘附到阀座的隔膜的一部分。 在另一个实施例中，阀膜片包括施加到隔膜操作中与阀座接触的部分的金属层。 金属层通过在高温操作期间防止膜片与阀座的粘合来延长阀的工作温度。 选择合适的金属层材料可以提高阀的化学惰性，从而降低流过阀门的材料与金属反应的可能性。

公开(公告)号：US20140044388A1

公开(公告)日：2014-02-13

申请号：US13569364

申请日：2012-08-08

申请人： Chung-Yi Su ,  Tak Kui Wang

发明人： Chung-Yi Su ,  Tak Kui Wang

IPC分类号： G02B6/12

CPC分类号： G02B6/428 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/425 ,  G02B6/4269 ,  H01L31/024

摘要： An opto-electronic system includes a system substrate, a lens, a bridging device, and an opto-electronic chip mounted in a cavity in the system substrate. The bridging device, which can be another chip, a lens block, or an interposer, is mounted in flip-chip orientation to the opto-electronic chip and provides electrical interconnection with signal conductors of the system substrate.

摘要翻译： 光电系统包括系统基板，透镜，桥接装置和安装在系统基板中的空腔中的光电芯片。 可以是另一芯片，透镜块或插入件的桥接装置以倒装芯片方向安装到光电芯片，并提供与系统基板的信号导体的电互连。

公开(公告)号：US08328434B2

公开(公告)日：2012-12-11

申请号：US12628163

申请日：2009-11-30

申请人： Tak Kui Wang ,  Chung-Yi Su ,  Jesse Chin

发明人： Tak Kui Wang ,  Chung-Yi Su ,  Jesse Chin

IPC分类号： G02B6/36

CPC分类号： G02B6/4201 ,  G02B6/4214 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4261 ,  G02B6/428 ,  G02B6/4284 ,  G02B6/4292

摘要： A USB connector is provided that has an OE module and high-speed electrical connections integrated therein. The OE module includes an optical module, at least one laser diode, at least one photodiode, an optical transceiver IC, and a PCB. The optical module, the laser diode, the photodiode, and the IC are mounted on a surface of the PCB. The OE module is secured within the USB connector. The PCB includes conductive traces and electrical contact pads. The conductive traces electrically connect the IC with the contact pads. The contact pads are electrically connected via through holes formed in the PCB to the high-speed electrical connections, which, in turn, are electrically connected to conductive traces of a motherboard or a computer.

摘要翻译： 提供了一个USB连接器，其具有OE模块和集成在其中的高速电气连接。 OE模块包括光学模块，至少一个激光二极管，至少一个光电二极管，光收发器IC和PCB。 光学模块，激光二极管，光电二极管和IC安装在PCB的表面上。 OE模块固定在USB连接器内。 PCB包括导电迹线和电接触焊盘。 导电迹线将IC与接触垫电连接。 接触垫通过形成在PCB中的通孔电连接到高速电连接，高速电连接电连接到主板或计算机的导电迹线。

公开(公告)号：US20110311188A1

公开(公告)日：2011-12-22

申请号：US12821001

申请日：2010-06-22

申请人： Tak Kui Wang ,  Chung-Yi Su ,  Bing Shao

发明人： Tak Kui Wang ,  Chung-Yi Su ,  Bing Shao

IPC分类号： G02B6/36

CPC分类号： G02B6/4292 ,  G02B6/3817 ,  G02B6/4201 ,  G02B6/4214

摘要： An opto-electronic module connector system is mountable on a system substrate, such as a printed circuit board, in a variety of configurations or orientations and includes an electromagnetic interference (EMI)-shielding enclosure, a connector assembly, and a socket. The connector assembly includes a connector body, a connector printed circuit board, a substantially planar contact holder, electrical contact fingers mounted on the contact holder, and an opto-electronic module. When the EMI-shielding enclosure and socket are mounted on the system substrate, a user can readily insert the connector assembly into the EMI-shielding enclosure and plug it into the socket. A user can likewise readily remove the connector assembly from the EMI-shielding enclosure and socket for maintenance, cleaning, repair or other purposes.

摘要翻译： 光电模块连接器系统可安装在各种配置或方向的诸如印刷电路板的系统基板上，并且包括电磁干扰（EMI）屏蔽外壳，连接器组件和插座。 连接器组件包括连接器主体，连接器印刷电路板，基本平面的触点支架，安装在触点支架上的电触点指示器和光电模块。 当EMI屏蔽外壳和插座安装在系统基板上时，用户可以轻松地将连接器组件插入EMI屏蔽外壳并将其插入插座。 用户也可以容易地从EMI屏蔽外壳和插座中移除连接器组件，以进行维护，清洁，修理或其他目的。

公开(公告)号：US20110305417A1

公开(公告)日：2011-12-15

申请号：US12815643

申请日：2010-06-15

申请人： Tak Kui Wang ,  Ronald T. Kaneshiro ,  Chung-Yi Su ,  Craig T. Cummings ,  Ye Chen ,  Bing Shao

发明人： Tak Kui Wang ,  Ronald T. Kaneshiro ,  Chung-Yi Su ,  Craig T. Cummings ,  Ye Chen ,  Bing Shao

IPC分类号： G02B6/26 ,  G02B6/36

CPC分类号： G02B6/3817

摘要： In a connector system, a first connector is mechanically and optically mateable with a second connector to form one or more optical signal communication links A wiping cleaner is included on at least one of the first and second connectors for cleaning an optical port of the other of the first and second connectors when the connectors are plugged together. The first and second connectors can further be electrically mateable to provide both optical and electrical signal communication links

摘要翻译： 在连接器系统中，第一连接器机械和光学地与第二连接器配合以形成一个或多个光信号通信链路。擦拭清洁器包括在第一和第二连接器中的至少一个上，用于清洁另一个的光口 当连接器插在一起时，第一和第二连接器。 第一和第二连接器可以进一步电可配对以提供光学和电信号通信链路

公开(公告)号：US07780302B2

公开(公告)日：2010-08-24

申请号：US12339793

申请日：2008-12-19

申请人： Tak Kui Wang

发明人： Tak Kui Wang

IPC分类号： G02B7/182

CPC分类号： G02B7/182 ,  G02B5/08 ,  Y10S359/90

摘要： In a method of forming a device so as to include a reflective surface at a specific angle to an incident optical axis, a region of a first major surface of a substrate is exposed to an anisotropic etchant to form a surface having the specific angle with respect to the first major surface, but the etched surface is then used as a mounting surface. That is, rather than anisotropically etching a reflective surface, the etching provides the mounting surface and the second major surface of the substrate functions as the reflective surface when the fabricated device is properly mounted. The substrate may be a silicon wafer having a 9.74 degree off-axis cut. Then, a 45 degree mirror is formed by the process. When the reflector is used in an optical device, the crystalline plane will be generally parallel to the surface of the support.

摘要翻译： 在形成器件的方法中，包括与入射光轴成特定角度的反射表面，衬底的第一主表面的区域暴露于各向异性蚀刻剂以形成具有相对于 到第一主表面，然后将蚀刻的表面用作安装表面。 也就是说，不是各向异性地蚀刻反射表面，蚀刻提供了安装表面，并且当制造的器件被正确安装时，衬底的第二主表面用作反射表面。 衬底可以是具有9.74度离轴切割的<100>硅晶片。 然后，通过该过程形成45度镜。 当反射器用于光学装置时，<111>晶面将大致平行于支撑体的表面。

公开(公告)号：US07358109B2

公开(公告)日：2008-04-15

申请号：US10993894

申请日：2004-11-18

申请人： Kendra Gallup ,  Brenton A. Baugh ,  Robert E. Wilson ,  James A. Matthews ,  James H. Williams ,  Tak Kui Wang

发明人： Kendra Gallup ,  Brenton A. Baugh ,  Robert E. Wilson ,  James A. Matthews ,  James H. Williams ,  Tak Kui Wang

IPC分类号： H01L21/00

CPC分类号： H01S5/02288 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/183 ,  H01S5/423 ,  H01L2224/05599

摘要： A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

摘要翻译： 用于表面发射激光器的封装将模具封装在子安装座和盖子之间。 可以使用允许将多个管芯附接到子安装晶片的晶片级封装工艺的晶片处理技术来形成子安装座和盖子，将分开的或作为盖子晶片的一部分的盖子附接到子安装晶片， 并切割结构以分离单个包装。 该盖包括透明板，该透明板可被加工成结合诸如透镜的光学元件。 安装在盖上的对准柱表示来自激光器的光信号的位置，并且紧密地配合在套筒的一端，而光纤连接器适合于另一端。