Invention Grant
- Patent Title: Method and apparatus for EUV mask having diffusion barrier
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Application No.: US13827969Application Date: 2013-03-14
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Publication No.: US08940463B2Publication Date: 2015-01-27
- Inventor: Wim Y. Deweerd
- Applicant: Intermolecular Inc.
- Applicant Address: US CA San Jose
- Assignee: Intermolecular, Inc.
- Current Assignee: Intermolecular, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: G03F1/22
- IPC: G03F1/22 ; G03F1/24 ; G03F1/52

Abstract:
A photomask is provide. The photomask includes a substrate having a multi-layer stack disposed over the substrate. The multilayer stack has alternating first second and third layers disposed over each other, wherein the first, second and third layers are composed of first, second and third materials, respectively, and wherein at least the second layer is formed through an atomic layer deposition process. A capping layer is disposed over the multilayer stack; and an absorber layer disposed over the capping layer. A method for evaluating materials, unit processes, and process sequences for manufacturing a photomask is also provided.
Public/Granted literature
- US20130209927A1 Method and Apparatus For EUV Mask Having Diffusion Barrier Public/Granted day:2013-08-15
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