Invention Grant
- Patent Title: Semiconductor packages and methods of forming the same
- Patent Title (中): 半导体封装及其形成方法
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Application No.: US14272681Application Date: 2014-05-08
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Publication No.: US08940584B2Publication Date: 2015-01-27
- Inventor: Tongsuk Kim , Jangwoo Lee , Heeseok Lee , Kyoungsei Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2011-0084108 20110823
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/06 ; H01L23/10 ; H01L23/31 ; H01L23/552 ; H01L23/498 ; H01L21/56 ; H01L23/34 ; H01L25/065 ; H01L23/36 ; H01L23/42
Abstract:
A semiconductor package including a package substrate having a chip mounting region and a peripheral region and including a ground layer formed in the peripheral region, first solder balls on the package substrate in the chip mounting region, second solder balls on the ground layer, at least one semiconductor chip stacked on the package substrate in the chip mounting region, and a package cap covering the semiconductor chip and contacting the package substrate in the peripheral region may be provided. The package cap is electrically connected to the second solder balls. Methods of fabricating the semiconductor package are also provided.
Public/Granted literature
- US20140239477A1 SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME Public/Granted day:2014-08-28
Information query
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