Invention Grant
US08941113B2 Semiconductor element, semiconductor device, and manufacturing method of semiconductor element
有权
半导体元件,半导体器件以及半导体元件的制造方法
- Patent Title: Semiconductor element, semiconductor device, and manufacturing method of semiconductor element
- Patent Title (中): 半导体元件,半导体器件以及半导体元件的制造方法
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Application No.: US13803022Application Date: 2013-03-14
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Publication No.: US08941113B2Publication Date: 2015-01-27
- Inventor: Toshihiko Takeuchi , Kosei Noda
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2012-081477 20120330
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/04 ; H01L29/49 ; H01L29/786 ; H01L27/148

Abstract:
To provide a semiconductor element in which generation of oxygen vacancies in an oxide semiconductor thin film can be suppressed. The semiconductor element has a structure in which, in a gate insulating film, the nitrogen content of regions which do not overlap with a gate electrode is higher than the nitrogen content of a region which overlaps with the gate electrode. A nitride film has an excellent property of preventing impurity diffusion; thus, with the structure, release of oxygen in the oxide semiconductor film, in particular, in the channel formation region, to the outside of the semiconductor element can be effectively suppressed.
Public/Granted literature
- US20130256665A1 SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT Public/Granted day:2013-10-03
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