Invention Grant
- Patent Title: Method and apparatus for chip cooling
- Patent Title (中): 芯片冷却方法和装置
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Application No.: US12128290Application Date: 2008-05-28
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Publication No.: US08944151B2Publication Date: 2015-02-03
- Inventor: Matteo Flotta , Yves C. Martin , Lubomyr T. Romankiw , Theodore G. Van Kessel
- Applicant: Matteo Flotta , Yves C. Martin , Lubomyr T. Romankiw , Theodore G. Van Kessel
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Louis Percello
- Main IPC: F28D15/00
- IPC: F28D15/00 ; H01L23/473
Abstract:
In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.
Public/Granted literature
- US20090294106A1 METHOD AND APPARATUS FOR CHIP COOLING Public/Granted day:2009-12-03
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